Henkel develops conformal coating metal inks, enabling semiconductor package-level EMI shielding through cost-effective direct spraying methods

Henkel Adhesive Technologies’ Electronics business today announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic interference (EMI) shielding. LOCTITE ABLESTIK EMI 8660S and LOCTITE ABLESTIK EMI 8880S offer superior flexibility in deployment and design, as they may be used with cost-effective spray coating equipment, while providing EMI shielding performance comparable to or better than capital-intensive, thin film metal deposition techniques. With excellent adhesion to a variety of epoxy molding compounds, both materials enhance long-term reliability performance.

“The proliferation of higher-frequency wireless communication standards, the continuing expansion of device functionality alongside decreasing component size, and the increase in printed circuit board (PCB) densities have accelerated the need for more effective and adaptable package-level EMI shielding solutions,” explains Jinu Choi, Henkel Market Segment Head for Emerging Applications in Semiconductor Packaging Materials. “Henkel’s new conformal shielding inks enable the deposition of an ultra-thin, highly electrically conductive layer that provides the shielding effectiveness of pure metal, with greater production scalability at a fraction of the cost of other shielding methods. Our solutions are distinctive, providing shielding effectiveness up to 80 percent higher than traditional organic-based conductive inks.”

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