Henkel Liqui-Form® 3500 one-part gel a breakthrough for thermal interface materials


Liqui-Form® 3500 one-part gel delivers high thermal conductivity and process flexibility.

Henkel Adhesive Technologies announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. A one-part, thermally conductive, liquid formable gel, Liqui-Form 3500 combines high thermal conductivity with process flexibility and excellent reliability.

Designed to provide a balance between dispensability, low component stress and reworkability, Liqui-Form 3500 delivers high conductivity of 3.5 W/m-K in a formulation that accommodates modern manufacturing environments. The viscosity of the material is exceptionally stable and is maintained during storage, processing and within the application.

“In many cases, Liqui-Form gels are an ideal replacement for traditional thermal interface pads,” explains Jerry Schmitz, Liqui-Form Product Line Manager. “With assemblies that have numerous small parts, manually placing multiple pads is cumbersome, labor-intensive and can introduce unnecessary mechanical stress during final assembly. In applications with high value boards requiring end-of-line rework, Liqui-Form 3500 is quickly removed with a wipe and a final clean. The inherently low adhesion stress minimizes risk of damage when disassembling the part, allowing manufacturers to preserve the integrity of the printed circuit board assembly.”

As Liqui-Form 3500 is pre-cured and has a higher viscosity than conventional thermal greases, it does not suffer from material migration – or “pump out” – over time, which contributes to its long-term reliability. In addition, the material has low volumetric expansion and stability in continuous use at temperatures as high as 200°C. Industry-leading low ionics is also a unique characteristic of Liqui-Form 3500, significantly reducing the threat of any potential electrical issues.

Liqui-Form products greatly simplify the procurement process and inventory management. The ability to source a single material as opposed to numerous thermal interface pads streamlines the BOM, saves time and lowers cost. Because these one-part formulations are fully cured, there is no mixing, refrigeration or post-curing required, allowing manufacturers to integrate Liqui-Form materials into their processes with high confidence.

Liqui-Form 3500 is a win-win for electronics manufacturers,” notes Schmitz in summary. “Highly thermally conductive, compatible with automated dispensing processes for excellent throughput, easily reworkable and a single material solution, Liqui-Form 3500 addresses today’s demanding requirements – and then some!”

For more information on Henkel’s line of Liqui-Form products, visit www.henkel-adhesives.com/thermal



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