Henkel’s GAP FILLER 1400SL offers robust thermal performance and void filling capabilities
Henkel Adhesive Technologies continues to expand its thermal materials portfolio and today announced the development and commercialization of GAP FILLER 1400SL. An evolution in thermal interface materials, GAP FILLER 1400SL combines the properties of low viscosity and, relative to conventional self-leveling products, comparatively high thermal conductivity in a unique formula designed to accommodate challenging architectures.
A two-part, silicone-based, liquid gap filling material, GAP FILLER 1400SL has extremely low viscosity which allows the material to flow in and around tight, uniquely shaped structures to fill small voids and provide excellent thermal transfer. With a thermal conductivity of 1.4W/m-K, GAP FILLER 1400SL unites high thermal conductivity and exceptional flow – characteristics that have traditionally been mutually exclusive – to allow new levels of design latitude.