Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published techniques for selective soldering demanding components.  This technical paper encompasses critically important information about the selective soldering process and is entitled “Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components.”  This 8-page tech paper outlines essential information for circuit board assembly and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.

Topics covered within this publication include flux selection guidelines, process control essentials, PCB design considerations, and processing of thermal demanding components.  The advantages of gold removal, mitigation of gold embrittlement and solderability testing as part of a component re-tinning operation are covered including testing methods and test standards.


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