Hentec/RPS Introduces Next Generation Solderability Test Systems
Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of precision soldering automation equipment for electronics assembly and manufacturing, today announced the release of the latest generation of solderability test systems; The Photon Steam Aging System and Pulsar Solderability Test System.
The Photon Steam Aging System is designed to meet military and commercial high reliability specifications of J-STD-002 and other applicable standards for artificial aging of all electronic components and circuit boards. The systems are designed to accommodate all package styles including high density, discrete components, relays, transistors, capacitors, including SMT and axial components.
The Pulsar provides precise handling of electronic components for the automated process of flux and solder dip of component terminations according to the requirements of J-STD-002 and other applicable standards for the “Dip and Look” method. After the flux and solder process, an engineer inspects the terminations to verify proper wetting. If adequate, the component is thereby validated for authenticity and solderability with the selected solder alloy. The Pulsar can tin virtually any component from axial resistors to QFP’s and other leaded and leadless packages.
“The new solderability test systems are the evolution of products developed through 20+ years of process experience and expertise,” said Reid Henry, President of Hentec Industries, Inc. “We are always looking to improve our systems and offer our customers increased process control and durability. These systems do that.”