High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements
Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products. The patent-pending LOCTITE® ABLESTIK® ABP 8068T portfolio includes high thermal, semi-sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high power density devices.
The expanded functionality and shrinking dimensions of devices within mobile, datacom/telecom, consumer and automotive applications are driving increased power densities and resulting in the need to manage heat dissipation more effectively. The use of thermal interface materials provides this relief at the board and component level, but more capable solutions at the die level are an important piece of the holistic thermal management equation.