Indium Corporation features InFORMS® reinforced solder preforms at NEPCON South China 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON South China 2017, Aug. 29-31 in Shenzhen, China.

Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.

When InFORMS® were used to solder a DBC to the baseplate of an IGBT, one study showed:

4x improved thermal cycling reliability compared to a solder preform-only approach
2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
Reduced voiding (<1%) Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS® require no additional process steps or equipment For more information about InFORMS®, visit www.indium.com/informs.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.http://globalsmt.net/wp-admin/media-upload.php?post_id=27648&type=image&TB_iframe=1

0

Start typing and press Enter to search