Koh Young Technology to Premier New 3D AOI system at JPCA 2017
Tokyo, Japan — Koh Young Technology announced today that it will showcase its latest innovations including its full 3D AOI with the new theme ‘True 3D now powered by Intelligent Platform’ in booth 4E-24 at the upcoming JPCA Show 2017 – scheduled to take place June 7 to 9, 2017 in Tokyo, Japan.
Koh Young, recognized as a leader in AOI technology, will premier its new 3D AOI system, which measures the true profilometric shape of components, solder joints, patterns on assembled PCB with patented 3D measurement. This innovative AOI system will be configured with 12 Mega Pixel Side-View Cameras in addition to the 12 Mega Pixel Top-Down Camera, offering height measurement of components up to 25mm in height.
Koh Young will also display its world-best performance 3D SPI system – aSPIre 3. From true 3D Foreign Material Inspection to Auto-verification features, Koh Young’s 3D SPI system has established a remarkable reputation for industry-leading measurement accuracy and inspection reliability.
The KSMART software solution connects inspection results from Koh Young’s 3D SPI systems and 3D AOI systems so that the defect root cause can be traced, analyzed, and removed as early as possible in the process. Key Features: Link@KSMART, SPC@KSMART, Library Manager with additional options RTM (Real Time Monitoring) and RMS (Remote Monitoring System).
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, visit www.kohyoung.com.