Koh Young Technology’s SPI goes beyond 3D Inspection with New Auto Repair Feature

January 17, 2018 – Chandler, AZ – Koh Young Technology, the leading 3D inspection solutions provider, helps manufacturers improve quality and productivity by adding automated solder paste dispensing to its KY8030-3, the world’s fastest 3D SPI (Solder Paste Inspection). The company will demonstrate the high-precision, user-friendly dispensing system on the KY8030-3 in Booth 2733 at 2018 IPC APEX Expo, which is scheduled for February 24 to March 1, 2018 in the San Diego Convention Center.

 

KYA Auto Repair Feature Graphic.pngEliminate Costly Mistakes

Industry experts agree, screen printing generally accounts for 70 to 80 percent of printed circuit board assembly defects. With greater design and assembly challenges, including the widespread use of fine-pitch components and microchips, insufficient solder has become a significant problem. This issue causes multiple challenges like open joints and lean fillets, as well as weak joints susceptible to breaking during subsequent assembly processes, transportation, or even field use. The defect is costly, but can be automatically repaired with the KY8030-3 dispensing solution.

 

Lowest Cost of Ownership

Koh Young has introduced a solution to the problem with its high-performance Auto Repair feature. An integrated dispenser within the KY8030-3 prevents insufficient solder, so manufacturers can reduce its costs by potentially eliminating board scrap or cleaning. Not only does the world’s fastest 3D SPI provide accurate inspection with real-time board warp compensation, the KY8030-3 configured with the Auto Repair option enhances first pass yield and reduces operational costs. Koh Young’s 3D SPI is more than an inspection system, it is a process optimizer.

 

Easy Maintenance

Koh Young has considered system maintenance and usability in the Auto Repair system design, which extends the service and cleaning interval to upwards of seven days. For example, the syringe holder incorporates a one-touch release for easy and quick replacement. The minimized maintenance requirements improve the Return on Investment (ROI) by reducing labor and material costs. Additionally, operators can readily verify rework performance by comparing rework result. The system provides both 2D and 3D images of the pads before and after dispensing, so operators can monitor the process to make better decisions.

 

As the absolute leader in the SPI and AOI markets, Koh Young Technology will demonstrate its high-speed KY8030-3 SPI system with the new Auto Repair function. What’s more, the company will participate in several show activities, including topical roundtable discussions and interviews on the smart factory and inspection process. If you cannot attend the show to visit Koh Young at Booth 2377, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.

 

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About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.

 

For additional information:
Koh Young Americas, Inc., 6150 West Chandler, Blvd, suite 39, Chandler, AZ 85226. America@KohYoung.com +1.480.403.5000 www.KohYoung.com

 

Koh Young America Editorial Contact

Brent Fischthal (Media Relations) +1.704.651.2860 Brent.Fischthal@KohYoung.com

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