Kulicke & Soffa extends memory solutions with launch of IConnPS MEM TM PLUS wire bonder series

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “company”), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, today announced the launch of its IConnPS MEM TM PLUS High Performance Wire Bonder series.

The IConnPS MEM TM PLUS is built on the successful and industry leading IConnPS PLUS wire bonder platform, with newly developed hardware and process capabilities to improve throughput and yield, targets the growing complexities of stacked-die memory applications. Designed for performance, the IConnPS MEM TM PLUS is positioned to increase productivity and achieve the best cost of ownership by leveraging the latest process technology for bonding with silver, in addition to gold wire.

Nelson Wong, Kulicke & Soffa’s Vice President of Ball Bonder Business Line, said, “We continue to align our development efforts to enable the next generation of industry solutions. This series directly targets the memory segments requirements for high-reliability interconnects on an increasing stack of progressively thin die.”

The standard IConnPS MEM TM PLUS comes with a large 80mm bondable area as standard. Increased bondable area upgrades to 87mm with IConnPSMEM TM PLUS LA, and to 90mm with IConnPS MEM TM PLUS ELA are also available.

The company is currently engaged in evaluations with many major memory customers and OSATs. Please contact your local sales and service representative for more information.



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