New high thermal & impact reliability solder and water soluble flux from SHENMAO
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 – June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
SHENMAO’s high thermal / drop reliability series solder alloys can be used in a wide range of solder applications. The alloys have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging processes.
The PF906-S Sn/Ag4.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal reliability and is designed for use in automotive electronic applications.
The PF912-S Sn/Ag2.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal and impact reliability compared to conventional solder alloys such as SAC305 and SAC405.
SMF-WC53 Flux is a halogen-free, water-soluble flux designed for use in ball attachment to Cu-OSP substrates. Features include:
• Designed for flux print & transfer applications.
• Excellent solderability on Cu-OSP pad
• Good washability
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America. For more information, please visit www.shenmao.com