New liquid GAP FILLER from Henkel delivers thermal control, automation and reworkability

Building on the leading BERGQUIST brand thermal management portfolio, Henkel has developed a brand new liquid GAP FILLER material that offers the rare advantage of thermal interface material (TIM) reworkability without sacrifices in thermal conductivity or automation performance. BERGQUIST GAP FILLER TGF 1500RW delivers these three valuable benefits in a single material, extending even greater process flexibility and post-assembly adaptability.

Henkel’s peelable, liquid-applied thermal interface material removes cleanly from electronics to enable easy rework

Henkel’s new TIM is a one-part, cure-in-place liquid gap filler allowing use with automated dispensing equipment for high-volume manufacturing operations. Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity, and also delivers excellent low and high temperature mechanical and chemical stability.

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