New solder attach technologies streamline assembly in application-specific designs

Solder Attach technology consists of pre-incorporating a very precise amount of solder and flux into parts to be joined, which has greatly improved soldering results and streamlined production processes.

Already available in a wide range of interconnects, this technology has proven to deliver 100 percent solderability while eliminating expensive and variable secondary processes.

As described in this new Tech Bulletin, proven Solder Attach Technologies are now also being leveraged into a variety of custom from-the-ground-up designs to deliver 100 percent solderability and cost reduction within a widening range of application-specific product implementations.

Click Here to Read the Solder Attach Technologies Tech Bulletin


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