SHENMAO introduces 606-P133 solder paste for laser soldering
PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Within only several seconds of heating after dispensing, solder joint is well-formed with minimal flux residue and without splash or solder ball. Process time can be greatly reduced with extremely high yield rate.
PF606-P133 is approved by world leading electronic component manufacturers.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.