Zymet UA-2605-B reworkable Edgebond Adhesive enhances board level reliability of large WLCSP
WLCSP’s have a coefficient of thermal expansion of about that of silicon, 2.6 ppm/°C, and the CTE of the board is about 17 ppm/°C. The mismatch in CTE results in a considerable amount of stress when the two are assembled, as evidenced by the extensive strain induced grain recrystallization of solder that accompanied early failures. Use of the reworkable edgebond adhesive substantially reduced the damage accumulation, resulting in increased thermal cycle performance.
The benefits of using Zymet’s reworkable edgebond adhesive, over one of its reworkable underfills, are significant. No board preheat and dwell time are needed for capillary flow. The risks of underfill voids and flux-underfill incompatibilities are eliminated. And, when performing rework, there is no need to remove underfill residues from the entire footprint of the package, virtually eliminating the risk of pad damage.
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Zymet is a global supplier of adhesives and encapsulants, focused on the development and manufacture of enabling materials for the electronics industry. Requests for information regarding reworkable edgebond adhesive, or other advanced materials, may be submitted by email to firstname.lastname@example.org.
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