2017 HKPCA & IPC Show one of the world’s largest PCB & EA show returns in December overwhelming response from exhibitors ensures another year of growth

Leading PCB Industry Trade Show sets new record for number of booths

The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) will again be staged at the Shenzhen Convention & Exhibition Center, China. This year’s edition will run from 6 to 8 December 2017. With the theme of “Global Wisdom. Local Presence”, it is hoped that global collective intelligence can be drawn to the show for assisting industry insiders to apply those high-end technologies into local production and hence enhance their business development.

Overwhelming response brings a record turnout of exhibitors
Demand for booth space at this year’s show has been spectacular. As at July, 97% of booth space has already been allocated, with a long waiting list for the few remaining booths. 501 exhibitors are confirmed to attend, across a massive exhibition space of over 52,500 sq.m. covering Halls 1, 2 & 4 of the Shenzhen Convention & Exhibition Center. The final number of exhibitors is expected to be close to 550, taking up more than 2,600 booths – a new record for the show, making this the largest edition ever.

As in past years, most of the industry’s leading players will be present, with confirmed names including TTM, Elec and Eltek, Gainbase, Sunshine, World Mastery, WKK, Atotech, Harvar, Schmoll, Rohm & Haas, Jadason, Orbotech, Han’s CNC, C Sun, Protek, Hitachi Chemical, Isola, Schmid, Rogers, Universal P.C.B., Joint Stars, Topoint, Rockent, Farcien, Guangdong Guanghua, Carl Zeiss, Dupont, Bluiris and many more. These familiar names, complementing with many first-time exhibitors will bring fresh ideas and exciting new offerings to the show.

“We are delighted with this enthusiastic response, which reconfirms the HKPCA & IPC Show’s respected status as the industry’s most influential platform for sourcing and information and technology exchange.” said Dr. John W. Mitchell, President & CEO, IPC – Association Connecting Electronics Industries®. “The impressive line-up of exhibitors will showcase a comprehensive array of new and innovative technologies, products and services. At the same time, the Fair will offer knowledge exchange and learning opportunities through the International Technical Conference and PCB Design Conference where industry experts will share in-depth knowledge and insights on the latest industry innovations and trends.

Hong Kong Pavilion introduces new insights to the show
A new highlight of the show this year is the Hong Kong Pavilion. Spreading over 100 sq.m. of a common area surrounded by PCB manufacturers’ booths, this will be partitioned into four regions showing PCB or semiconductor products and technology in four different product categories: communication, computers, consumer electronics and automobiles. The superb manufacturing technologies for high value-added features will be presented. Meanwhile, it is expected to show the HK PCB manufacturers’ international perspective and strong commitment to the social responsibility.

Mr. Canice Chung, Chairman of the Hong Kong Printed Circuit Association, remarked: “We are particularly pleased to see the appearance of the Hong Kong Pavilion this year which reflecting Hong Kong’s pivotal role in setting new standards and directions for the industry. As the show brings together the elite of the global industry under one roof, the Pavilion adds a further dimension to the show’s important role in shaping the industry’s future.”

“Another important contribution to this mission is the numerous business and networking opportunities provided by the show. This year the PCB Design Competition plus the traditional Welcome Dinner and Golf Tournament will give participants plentiful chances to develop new business links and partnerships, as well as form new personal friendships, in a relaxed environment.”

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