A Retronix Process Innovation | Micro Device Hot Solder Dip

The industry now has a comprehensive all-inclusive solution for tinning requirements. 

Our new Retronix Micro Device Hot Soler Dip innovation is the only process to solve the dilemma of tinning micro components to GEIA STD. Retronix will be exhibiting at the IPC APEX Expo, please come visit us at stand 2711. 

It’s a well-known fact (there are hundreds of technical papers confirming) that tin whisker filaments can grow uncontrollably from tin plating. The threat posed by tin whiskers was previously resolved, by adding a small percentage of lead (Pb) during Sn electroplating however, with the onset of the RoHS directive, the issue has resurfaced. Since the ban on Pb, manufacturers of High Reliability electronics have been working on different strategies to prevent tin whiskers from forming, with varying levels of success.

One company will insist on 100% eutectic solder, whereas others, most popularly, use solder paste on lead-free components for self-mitigation. Self-mitigation is very dependent on the manufacturing process assuming some level of risk. In High Reliability, there is no room for error. As everyone knows, the industry has developed the GEIA-STD.  There is currently no solution available to process smaller dimensional components in volume as per the GEIA-STD. 

With the automated process designed exclusively by Retronix – Patent Pending – to tin, micro components such as 0402s, 0603s, and SOTs to GEIA STD, the industry finally has a comprehensive all-inclusive solution for tinning requirements.

  • The automated micro tinning process is carried out on approved plating systems.
  • The lead-free capacitors are picked up by a specially designed tool that can hold multiple components at a time.
  • The components are moved to the fluxing station & then accurately over the solder wave. The pre-programmed automated system ensures the dip is precise & consistent.

Our Micro Device Hot Solder Dip process offers a solution to tin even the smallest and most awkward of components to GEIA standard. For more information visit:



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