AIM to highlight REL61™ at SMT Hybrid Packaging on May 16th-18th, 2017
AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at SMT Hybrid Packaging, scheduled to take place on May 16th-18th, 2017 at the NürnbergMesse Exhibition Center in Nuremberg, Germany. AIM will highlight their revolutionary REL61™ lead-free solder alloy, along with their full line of solder assembly materials.
REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically voiding, cost, durability and tin whiskers. Combined with AIM M8 Solder Paste, REL61 has reduced voiding on BTC packages by over 45%, increasing both thermal performance and solder joint integrity. REL61 offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and low/no-silver solder alloys. Extensive testing indicates that REL61 can reduce tin whisker formation as well as outperform SAC alloys in thermal shock, vibration and drop shock resistance.
AIM will also highlight its full line of advanced solder materials, including solder paste, liquid flux and solder alloys, including its newly developed REL22™ solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at SMT Hybrid Packaging for more information.