AIM to participate at the IMAPS International Symposium on October 11-13th, 2016
AIM, a global manufacturer of solder assembly materials, will highlight their full range of specialty joining materials at the IMAPS 49th International Symposium on Microelectronics, scheduled to take place October 11-13th, 2016 at the Pasadena Convention Center in Pasadena, California. AIM will be located in booth 810.
AIM’s full range of specialty joining materials includes indium and gold/tin solders for assembly and a wide variety of indium alloys for various applications. AIM’s Specialty Division offers solders for fiber to ferrule soldering, laser die attach, hermetic packaging and sealing, thermal management, and for numerous other applications.
“We are looking forward to participating at this year’s IMAPS International Symposium,” said Brian O’Neill, AIM’s Specialty Materials Manager. “We are anticipating a great show and countless opportunities to connect and provide support to prospective and current AIM customers in the area.”
To discover all of the products AIM’s Specialty Division offers, including indium and lead-free solders, visit the company in booth number 810 at the IMAPS International Symposium.