AIM to participate at the SMTA Atlanta Expo & Tech Forum on April 19th, 2017

AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that it will highlight its revolutionary REL61™ lead-free solder alloy, along with its full line of solder assembly materials, at the SMTA Atlanta Expo & Tech Forum, scheduled to take place on April 19th, 2017 at the Infinite Energy Center in Duluth, Georgia. Additionally, AIM’s Technical Marketing Manager, Timothy O’Neill, will present at the techical forum.

O’Neill’s presentation will highlight salient details of two presentations: “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” and “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing.” The presentation on I/O stencil aperture modifications covers the challenges PCB assemblers face due to the combination of leadless terminations with underside ground/thermal pads. Based on his white paper, the second presentation covers the optimization of solder paste performance from receiving to reflow.

To discover all of AIM’s products and services, visit the company at the SMTA Atlanta Expo & Tech Forum for more information.

About Timothy O’Neill

Timothy O’Neill is the Technical Marketing Manager for AIM Solder. With nearly 25 years of experience in electronics soldering, Mr. O’Neill has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.

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