AIM to participate in SMTA New England on November 3rd, 2016
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, will highlight their innovative M8 No Clean Solder Paste along with their full line of solder assembly materials at the SMTA New England Expo & Tech Forum, scheduled to take place November 3rd, 2016 at the DCU Center in Worcester, Massachusetts.
M8 No Clean Solder Paste has been formulated to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8’s post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications.
Additionally, AIM’s R&D Manager, Dr. Mehran Maalekian, will be presenting at the SMTA New England Expo & Tech Forum on November 3rd, 2016. Dr. Maalekian’s presentation, “New Pb-free Alloys for Improved Reliability – Latest Results,” explores the use of a novel high reliability lead-free solder alloy, that contrary to the commonly used SAC305, can perform in harsh service conditions and provides superior creep resistance and mechanical properties for high reliability applications.
Dr. Mehran Maalekian received his PhD with distinction from Graz University of Technology, Austria in 2007. Through his long research career he has published and presented numerous scientific and technical papers on physical metallurgy, materials modeling, welding and soldering, including a chapter of the ASM Int. Handbook. Dr. Maalekian has won a number of national and international awards, such as from the International Institute of Welding. He serves as a reviewer of several scientific journals and is on the editorial board of “Science and Technology of Welding and Joining.”
To discover all of AIM’s products and services, visit the company at the SMTA New England Expo & Tech Forum.