AIM to highlight REL alloys at SMTA Empire on April 24, 2018
AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at the SMTA Empire Expo & Tech Forum, scheduled to take place April 24th, 2018 at the Holiday Inn Syracuse/Liverpool in Liverpool, New York. AIM will highlight their revolutionary REL61™ and REL22™ lead-free solder alloys, along with their full line of solder assembly materials.
AIM’s new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double that of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance, REL61 can lower process temperatures, prevent PCB damage, and reduce waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.
AIM will also showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To discover all of AIM’s products and services, visit the company at the SMTA Empire Expo & Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.