Akrometrix launches new tabletop shadow moiré (TTSM) at SMTA International
Akrometrix, LLC, the provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
The TTSM offers all of the software features of Akrometrix’s thermal warpage metrology systems, only at room temperature. Akrometrix is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.
The TTSM enables customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.