Akrometrix to showcase next-generation AXP Shadow Moiré System at APEX
Akrometrix, LLC, the provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will exhibit in Booth #704 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will demonstrate its next-generation Shadow Moiré System – the AXP 2.0.
Akrometrix has been supplying thermal warpage systems for more than 20 years utilizing the shadow moiré technique. This next-generation AXP system provides unparalleled warpage metrology with state-of-the-art lateral/top-bottom temperature uniformity.
AXP 2.0 is the industry leader in not only providing thermal warpage, but has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, Akrometrix is providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.