Alpha Assembly Solutions to present at the Exhibitor Forum at SMT Hybrid Packaging in Nuremberg this April

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present at the Exhibitor Forum at the SMT Hybrid Packaging Show which runs from Tuesday 26th –Thursday 28th April at the Exhibition Centre in Nuremberg.

Alpha’s Area Sales Manager for the DACH Region, Jan-Henryk Serzisko, will present on Alpha’s extensive range of product solutions to solve reliability issues. During his presentation, Mr. Serzisko will focus on ALPHA® Exactalloy® Preforms, one of the many solutions Alpha offers to increase reliability in electronic assemblies. He will elaborate on how Exactalloy® Preforms are used to precisely increase the solder volume in solder joints. This results in increased strength of the solder joints, enabling them to withstand harsh operating conditions and improve conductivity.

At the exhibition, Alpha will display an advanced range of solder pastes, including ALPHA® CVP-390, a zero-halogen, no-clean solder paste that can be used to increase reliability. CVP-390 provides excellent pin testing and consistent fine pitch printing capabilities. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability.

Jan-Henryk Serzisko will be presenting at the SMT Hybrid Packaging Exhibitor Forum on Thursday 28th April at 10.40am. The Forum is free with admission to SMT Hybrid Packaging.

For more information on Alpha’s product range visit Alpha at SMT Hybrid Packaging in Hall 7 Stand 109 where Alpha will be co-exhibiting alongside smartTec, its distributor for Germany, Denmark, Sweden and Norway or visit the Alpha website



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