Alpha Assembly Solutions to present latest product innovations for die attach applications at the Exhibitor Forum at PCIM, Nuremberg
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present at the Exhibitor Forum at the PCIM Exhibition which will be held at the Exhibition Centre in Nuremberg, Germany on Tuesday 10th – Thursday 12th May.
Alpha’s Global Product Manager for Sintered Materials, Julien Joguet will present how the reliability of power components can be enhanced using ALPHA® Argomax® silver sinter products. The Argomax® product range includes paste, film and preforms specially designed using highly engineered silver particles. The products enable low pressure sintering die attachment and provide high reliability, conductivity and performance.
In addition to ALPHA® Argomax® products, ALPHA® Atrox™ silver-filled die attach adhesives and ALPHA® Fortibond™ pressureless sintered paste will be presented at the show. ALPHA® Atrox™ technology was specifically designed for LED manufacturers that require a low temperature cure, low stress, a range of thermal conductivities and a high throughput die attach solution. Atrox™ is available in both paste and film.
ALPHA® Fortibond™ was designed for LED manufacturers that require pressureless sintering in their die attach process. Fortibond™ provides high thermal and electronical conductivity silver bonds with high reliability and flexible yet controlled bond line thickness.
Julien Joguet will be presenting at the PCIM Exhibitor Forum on Wednesday 11th May at 12.40pm. The Forum is free with admission to PCIM.
For more information on Alpha’s Advanced Die Attach Solutions visit Alpha at PCIM, Hall 6 Stand 211.
Date: Tuesday 10th May – Thursday 12th May
Venue: Exhibition Centre, Nuremberg, Germany