Alpha Assembly Solutions to feature void reduction technologies and recycling services at August SMTA Expos

Alpha Assembly Solutions, the world leader in the production of electronic soldering materials and solutions, will feature its Void Reduction Solutions technologies and Recycling Services at two upcoming SMTA Expos — the Austin (CTEA) Expo, in Austin, Texas taking place on August 14 and the Capital Expo & Tech Forum taking place on August 23 at Johns Hopkins Unvierstity in Laurel, Maryland.

The recently lauched ALPHA® OM-358 ultra-low voiding paste will be one of the Void Reduction Solutions technologies highlighted at the expos. Designed for high reliability applications, this paste exhibits excellent resistance to electrochecmical migration on fine pitch components. “This paste proves to be an excellent choice for Automotive, Medical, LED, and Defense customers,“ said Robert Wallace, Regional Marketing Manager for the Americas. “Using a high-soak profile, they can achieve less than ten percent voiding on bottom terminated components which means greater production efficiency, elemination of rework, and better electrical and thermal performance“.

In addition, Alpha will promote its Reclaim and Recycling Services program. For over 30 years, Alpha has been helping customers throughout the Americas dispose of their solder paste debris. As North America’s largest solder recycler, Alpha takes pride in having the safest, most efficient, environmentally-compliant recycling solution that sends no materials to landfills. The Reclaim and Recycling Services are an important component of Alpha’s Sustainability programs.

For additional information about Alpha’s industry-leading products and services, please visit


Start typing and press Enter to search