Alpha chosen to present during ITRI Asia Tin Summit in Shanghai
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, was invited to present on consumption and new tin applications during ITRI Asia Tin Week, to be held from November 21st-24th in Shanghai, China.
The topic, “Changes of Tin Application in Electronics Assembly Industry”, will be presented on November 23rd by Valentijn Van Velthoven, Regional Vice President of Asia Pacific for Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses. “Considering the change of macro environments, I would like to present the link between the macro trends we see in our everyday world and how they impact solders, how they are being used, what drives the markets, and ultimately, how they affect demand for solder and alloys,” said Valentijn. His presentation will specifically focus on Photovoltaic, Power Electronics and LED industries.
Asia Tin Week, organized by the global tin association, ITRI, comprises of two main formal sessions: the ITRI Asia Tin Summit focused on industry and market issues and the China International Solder Technology Forum. Both sessions are simultaneously translated in both English and Mandarin. This is the 4th ITRI event held in China following 2011 in Hangzhou, 2013 in Kunming and 2015 in Shanghai. With strong support from other world leading organizations, this event will provide a comprehensive forum for discussion and networking between members of the global tin industry.