Alpha features low temperature & void reduction solutions at 2017 SMTA International
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting at booth #1016 and giving multiple presentations during the 2017 SMTAI International Conference and Exhibition on September 17 – 21 held at the Donald E. Stephens Covention Center in Rosemont, Illinois.
At the show, Alpha will be featuring its latest low temperature and void reduction assembly process technology solutions. New products will be highlighted during the show as part of these solutions — a new generation low temperature solder paste, ALPHA® OM-550 and the innovative void reduction ALPHA® AccuFlux™ Technology for solder preforms. “OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,“ said Robert Wallace, Regional Marketing Manager for the Americas. “We feel this paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys.“
Both products will be included in the New Product Showcase and will also be a focus in several of the technical papers being presented. “Alpha has developed an innovative void reduction technology.“ said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. “The latest AccuFlux™ Technology for preforms has been specially designed to dramatically decrease voiding under bottom termination components, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge. Our paper, Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms, will present the results of a comprehensive study that Alpha and our partners recently conducted to examine the impact of Alpha’s AccuFlux™ Preform Technology on voiding under QFNs, QFPs and DPAK packages.“.
In total, Alpha will be presenting eight papers during the four day event, two of which will focus on low temperature technology and three addressing void reduction:
-Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms
-Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Heirarchy in SMT Assembly
-High Performance Electronic Interconnect Materials Characterization – Techniques & Challenges
-Low Temperature Soldering Using Sn-Bi Alloys
-A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation
-Effect of Voids on Thermo-Mechanical Reliability of Solder Joints
-Process, Design, and Material Factors for Voiding Control for Thermally Demanding Applications
-Low-Temperature Solder Paste Process Advantages.
To learn more about Alpha’s latest technologies and products, visit Booth #1016 at SMTAI or visit the Alpha Assembly Solutions website at alphaassembly.com