Alpha to introduce several new product technologies at productronica China 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will introduce a range of Electronics Assembly Polymers and High Temperature Dip Tinning Technologies at the upcoming Productronica China to be held in Shanghai from March 14th – 16th 2017.

The polymers being introduced by Alpha include products ranging from ALPHA® STAYCHIP® underfills, ALPHA® STAYCHIP® epoxy flux, ALPHA® STAYSTIK® low temperature adhesives and other ALPHA® STAYSTIK® epoxy related materials. “These products are for applications requiring reinforcement of assembled parts/components, low temperature bonding, UV bonding or Dual Curing bonding. Selecting the right Assembly Polymers for your application is critical”, said Jimmy Shu, Director of Marketing for the Asia Pacific Region.

“ALPHA® SnCX-FT07, SACX0307-FT, SnCu3-FT are lead-free alloys suitable for high temperature dipping and lead tinning applications and are suitable to be adopted under high temperature processes > 350°C”, said Bernice Chung, Regional Product Manager for Alloys. She continues, “The alloys have been engineered to retain a highly reflective solder surface with very minimal surface oxide layer formation after long hours of high heat exposure, as compared to the generic alloys such as SnCu0.7 and SnCu3 alloys. The superior wetting performance of this alloy along with reduced pot maintenance due to low dross rates help improve production yield”.

In addition, Alpha will feature a new low temperature solder paste, ALPHA® OM-550 HRL1, that will soon be coming to market. “ALPHA® OM-550 HRL1 brings together SAC305-type mechanical and thermal reliability in a low temperature alloy to board level assemblies, which has never been done before,” said Phua Teo Leng, Regional Product Manager for Solder Paste. “This material meets reliability requirements typical of motherboard and mobile assemblies, and supports our customers’ endeavor to reduce their carbon footprint without impacting performance.”

Apart from introducing the above technologies, Alpha will feature ALPHA® OM-353 & ALPHA® OM-535 lead-free, no-clean solder pastes, and ALPHA® EF-2100 liquid soldering flux at their exhibit. To learn more about these materials and all NEW ALPHA® Products, please visit Alpha at Productronica China 2017 – Hall E3, Booth 3146


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