Alpha to promote new technologies at SMTA Orange County Expo & Tech Forum, November 2, 2017, Long Beach, CA

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be promoting its newest low-temperture and low-voiding technologies at the 2017 SMTA Orange County Expo & Tech Forum, taking place on November 2 at The Grand Event Center, Long Beach, CA.

The two products to be highlighted during the Expo are Alpha’s new low temperature solder paste, ALPHA® OM-550 and the innovative void reduction ALPHA® AccuFlux™ BTC-578 Preform System. Both products are setting new industry standards for performance and relaibility.

Among its many features, ALPHA® OM-550 low temperature solder paste reduces warpage up to 99%, increasing production yields and reducing energy consumption. “This paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability in comparison to other low temp alloys.“, said Robert Wallace, Regional Marketing Manager for the Americas. “We are very excited about this new paste, as it is a low temperature solution for customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy.“

Alpha’s AccuFlux™ BTC-578 Preform System is a low void technology system designed to provide reliable low voiding for bottom terminated components. “The ALPHA® AccuFlux™ BTC-578 Preform System has been specially designed to dramatically decrease voiding, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge,“ said Jerry Sidone, Preforms Product Manager at Alpha Assembly Solutions.

In addition, Alpha will also feature its Recycling Services which offers electronic assemblers the safest, most efficient, environmentally-compliant solution for turning production waste streams into revenue for its customers. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper.


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