Alpha to Showcase Latest Products for Die Attach and SMT Assembly Solutions at Internepcon Japan 2018
Alpha Assembly Solutions, the world leader in the production of electronic soldering materials and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the 2018 Internepcon Japan show to be held in Tokyo from January 17th – 19th, 2018.
At the show, Alpha, a part of the MacDermid Performance Solutions group of business, will be exhibiting its latest range of products for SMT Assembly Solutions, Die Attach Assembly Solutions and Industrial Assembly Solutions. The products include Agromax®, Atrox®, High Temperature Dipping Alloys, Low Melting Point Solder Paste, Assembly Polymers, Innolot Alloys, PowerBond and AccuFlux.
In addition, Alpha will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the ALPHA® AccuFlux™ BTC-578 Preform System. The system combines ALPHA® AccuFlux™ BTC-578 Preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.
For more information on Alpha’s latest product technologies, visit Alpha Assembly Solutions Booth at Internepcon Japan Hall East 5-4.
About 47th Internepcon Japan
Internepcon Japan is the world’s leading SMT exhibition gathering Equipment, Solutions and Services for Electronics Manufacturing. For more information, visit www.nepconjapan.jp/en/Home/
Date: Wednesday 17th – Friday 19th January 2018 (10:00-18:00, Last Day until 17:00)
Venue: Tokyo Big Sight, Japan