Analysis SMT Hybrid Packaging 2016: Praises for individual solution platform and exchange of knowledge on a high level

Exchanging know-how, finding customized solutions with branch experts, gathering information on the latest trends and developments of the SMT industry – this and much more was offered at SMT Hybrid Packaging 2016.

Facts and figures at a glance

266 (63 percent) of the 420 exhibitors came from Germany, 154 exhibitors (37 percent) from foreign countries. A total of 15,104 people visited SMT Hybrid Packaging – of which 72 percent were from Germany and 28 percent from other countries abroad. The strongest European visitor contingents hailed from Czech Republic, Austria and Switzerland.

Manufacturing equipment as visitor attraction

37 percent of the visitors were very interested in manufacturing equipment. Moreover they caught up on materials and components, manufacturing planning as well as reliability and test. The visitor survey revealed another positive result: 96 percent of the visitors could find at SMT Hybrid Packaging customized solutions for their companies. In particular the exhibitors appreciated the excellent discussions with highly qualified trade visitors.

Further highlights: Forums, joint stands, production line

Also very well attended were the exhibition forum and the PCB / EMS forum. Visitors had the possibility to enlarge their knowledge via top-class papers and a panel discussion on all three exhibition days. Over 90 percent of the visitors used the versatile program consisting of the joint stands High Tech PCB Area, EMS-Intersection and Optics meets Electronics as well as the highlights Production line “Future Packaging”, the Rework Experience Area and the IPC Hand Soldering Competition.

Conclusion: compact, comprehensive, up to date

Many visitors and exhibitors appreciated the SMT Hybrid Packaging as the most important European platform for system integration in microelectronics.

Martin Marin, Production Manager, Metrel d.d. summarizes as visitor: “We are completely satisfied with high level of exhibitors support and with the organization of this event.”

Praises could also be heard from exhibitors for the high quality of the event: “The wealth of product diversity combined with the technical expertise available makes this event something not to be missed.” emphasizes William Garrett, SMT Principal at Methode Electronics Malta Ltd.

Next year the SMT Hybrid Packaging will take place in Nuremberg from 16 – 18 May 2017.

Latest information is available at or can be obtained from the organizer Mesago Messe Frankfurt at

About Mesago

Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 130 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. Mesago comprises three companies: Mesago Messe Frankfurt GmbH, Mesago Messemanagement GmbH and Mesago PCIM GmbH.



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