ASM further extends its portfolio for the mid-speed segment
Debut at SMT Hybrid & Packaging 2017: Complete line solution with E by SIPLACE and E by DEK
After the successful rollout of the E by SIPLACE placement solution, ASM Assembly Systems is now following up with the E by DEK. Like the E by SIPLACE before, the new printing platform for mid-speed applications, high mix and prototype productions sets totally new standards in terms of quality, performance and modularity with core cycle times of 7.5 seconds incl. print and a repeat accuracy rating of ±12.5 µm @ 6 Sigma.
ASM distributors will offer the E by SIPLACE and E by DEK machines mostly as a line solution – also because details like a joint line monitor deliver additional benefits when both are employed together. Previously successful mostly in the high-end segment of electronics production, ASM is using the E-line to further advance its successful entry into new customer segments. After only nine months on the market, excellent distributors in 32 countries have already signed on to sell the E by SIPLACE. Almost 90 percent of the machine’s users are new customers whom ASM was previously unable to reach with its products. The new printing platform E by DEK will make its Europe-wide debut at SMT Hybrid & Packaging (Booth 4.219).
“Our E-line strategy focuses on offering powerful solutions with high-quality components that set new standards in their performance and in the mid-speed segment. Customers and distributors obviously appreciate this approach. We are getting in touch with electronics producers who focus on all-round, high mix and prototype applications. This is a fascinating market with huge growth potential for ASM worldwide. The E by DEK continues on this successful road,” says Andreas Brockt, responsible for the E business at ASM Assembly Systems, about the introduction of the E by DEK machine.
Technology leader ASM had previously demonstrated its ambitions with the introduction of the E by SIPLACE series. It even formed a special E-team for the development of the new machine, which scores in its class with its unique combination of placement accuracy and speed. The sales approach was revised as well. The E by SIPLACE is the first SIPLACE product that is sold worldwide through distributors. Another innovation: Training and support are supplemented by an E-community and web portals that deliver huge flexibility and cost savings.
Distributors and users can now combine E by SIPLACE and E by DEK modules to form powerful and perfectly matched line solutions. These integrated E-lines offer additional benefits, such as the central line monitor that displays status messages for the entire line and keeps operators informed about each job’s progress.
Both the placement and printing modules of the E-line can be enhanced with a wide choice of options. This gives manufacturers additional investment protection since it enables them to address a wider range of customers and applications. With Application Packs an E-line can easily be configured to individual production requirements. Depending on the individual configuration, the E by DEK can handle e.g. flexible substrates oversized boards with lengths of up to 620 mm.
Visitors of the SMT Hybrid & Packaging can find the new printing platform E by DEK and the E by SIPLACE as a complete E-Line at booth 4.219 as well as at the booth of official German distributor SmartRep (4A.230).
Further information on the show program and ASM products are available at http://www.asm-smt.com/en/smt2017