Association News – June 2017

NA PCB Order Growth Pushes Book-to-Bill Ratio Higher

IPC — Association Connecting Electronics Industries announced today the April 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Although sales continued below last year’s levels, orders were up and the PCB book-to-bill ratio continued to climb, reaching 1.09.

Total North American PCB shipments in April 2017 were down 6.0 percent compared to the same month last year. This year to date, shipments are 4.5 percent below the same period last year. Compared to the preceding month, April shipments increased 10.8 percent.

PCB bookings in April increased 4.3 percent year-on-year, resulting in flat (0.0 percent) bookings growth compared the same period last year. Bookings were up 17.0 percent compared to the previous month.

“A continuation of sluggish sales and a rebound in orders for the North American PCB industry drove the April 2017 book-to-bill ratio to its highest level in 20 months,” said Sharon Starr, IPC’s director of market research. “Despite lagging sales, three consecutive months of positive and climbing book-to-bill ratios is a positive indicator for strengthening sales in the next three to six months,” she added.

www.ipc.org


Awards Announced for SMTA China East Conference 2017

SMTA China announced that it presented awards for Seven papers at the SMTA China East Conference 2017 Award Presentation Ceremony.

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled The Study of The Efeect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.

Kyzen’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled Cleaning Agent Innovation for Highly Dense Electronic Assemblies. 

Keith Bryant, from SMT Solutions and Michael Tang, from YXLON International GmbH received the award for The Best Presentation of Technology Conference One for the presentation titled Computer Tomography From Microelectronics To Assembled Products.

Dr. Wayne Koh, from Pacrim Technology Inc. received the award for The Best Presentation of Technology Conference Two for the presentation titled Progress In Low Temperature Lead-Free Solder for SMT Assembly.

Ji Xu, from ASM Assembly Systems Ltd. received the award for The Best Presentation of Vendor Conference One for the presentation titled Smart #1 SMT Factory-Our Smart Move to Industry 4.0.

Derek Wang, from AIM Solder (Shenzhen) Company Limited received the award for The Best Presentation of Vendor Conference Two for the presentation titled The Impact of Reduced Solder Alloy Powder Size On Solder Paste Print Performance.

Yu Xiang, from Shenzhen City TongFang Electronic New-material Co.,Ltd. received the award for The Best Presentation of Vendor Conference Three for the presentation titled QFN Solder Void Solution Study.

Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of Dispenser Machine and Model of AD-16.

Cencorp Automation Oy, received the award for The Best Exhibit Technology of the Year 2017 China East with the product of In-Line Router and Model of 1000BR.

smta.org.cn

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