At NEPCON China with VisionXP+ Vac and CondensoXC
Rehm presents new equipment for reflow soldering
NEPCON China is one of the most important trade fairs for the electronics sector in Asia. From 29 to 31 August 2017, visitors in Shenzhen can find out about innovations from the world of electronics manufacturing in the areas of consumer electronics, communication, automotive and medical technology. In Hall 1 Booth 1J55, Rehm Thermal Systems is set to present the new VisionXP+ Vac, an efficient system for reflow convection soldering and the CondensoXC, a compact system for reliable condensation soldering. Our team on site is looking forward to your visit!
VisionXP+ Vac: The 2-in-1 solution for reflow convection soldering
The VisionXP+ Vac combines numerous further developments, above all in respect to the optimisation of energy management and the reduction of emissions. The plant allows customers to save up to 20 % energy during electronics production and consume 10 tonnes less CO2 on average per year. The vacuum option makes convection processes with or without vacuum possible for the first time – in one system! Gas inclusions can be eliminated reliably inline during the convection soldering process. With a vacuum of up to 2 mbar, void rates of less than 2 % can be achieved. As a further new feature, the VisionXP+ Vac is optionally equipped with a second pyrolysis for even more effective residue management.
CondensoXC: Compact in design – big in the process
The CondensoXC for reliable condensation soldering is compact in design and impressive in performance thanks to its innovative process chamber. The patented injection principle means exactly the right amount of Galden® is supplied to the process, for optimal profiling. The closed-loop filter system allows the medium to be recovered and filtered almost 100 %. The system is fully vacuum-compatible and has an integrated process recorder – for optimal traceability.
Visit Rehm at the NEPCON China in Hall 1, Booth 1J55!