Atotech to present at the 17th International Wafer-Level Packaging Conference 2020
Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate, and semiconductor manufacturing will participate in the upcoming IMPACT-EMAP 2020 Conference, which will be held in conjunction with TPCA Show 2020. The conference will be held from October 21 – 23, 2020 at the Taipei Nangang Exhibition Center.
This year, Atotech’s experts will participate in the following sessions:
Visitors of the conference are very welcome to attend Atotech’s presentations and also to visit the company’s booth N0613 at TPCA Show to talk directly to local and international experts to learn about the latest trends, products and equipment Atotech offers to the industry.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: email@example.com