Atotech to present at the 17th International Wafer-Level Packaging Conference 2020

Atotech, a global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, will present at this year’s IWLPC. The on-demand conference and expo will be held from October 13th through 30th.

Atotech’s expert, Roger Massey, will give a technical paper presentation entitled “Hydrogen embrittlement and nano void classification within electroless copper depositions”. His presentation is part of the 3D Integration track and will be available for viewing during the entire time the conference is open. Attendees of this virtually held conference are invited to watch Mr. Massey’s presentation.

For more information about Atotech or its product offering, please visit www.atotech.com or contact us at:

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