Atotech’s MultiPlate® for FOPLP, the topic everyone is talking about at IMAPS Device Packaging Conference 2018
BERLIN, March 1, 2018: At the upcoming IMAPS Device Packaging Conference 2018 next week, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging (FOPLP).
Image: Atotech’s revolutionary new tool called MultiPlate® for FOPLP
On Tuesday, March 6, from 11:30 am to 12 pm, Moody Dreiza, Business Director Electronics and Semiconductor for Atotech USA, LLC in North America will talk at the IMAPS 2018 technical conference for Fan-Out, Wafer Level Packaging and Flip Chip about what it means for manufacturing and especially equipment and chemistry to move from round shaped wafers to square shaped panels.
In his presentation, Moody, will specifically discuss what Atotech’s new plating tool “MultiPlate®” can do for FOPLP type of applications. MultiPlate® is Atotech’s new and versatile production tool for wafer-level packaging and panel-level packaging, depending on customer needs. The tool offers the flexibility manufacturers are looking for, while at the same time provides optimal performance in advanced packaging technologies. In combination with Atotech’s newly developed electrolytes for high-speed copper RDL plating for various panel formats, the plated copper deposits show excellent physical properties when plated at high current densities. The tool thereby allows for the deposition of highly pure copper, leading to higher throughput, lower voiding and better reliability.
To learn more about Atotech’s MultiPlate® visitors to the IMAPS DPC 2018 are invited to attend Moody Dreiza’s talk at the technical conference on March 6, from 11:30 am to 12 pm.
Alternatively, visitors can get in touch with several other Atotech product specialists who will be on-site. The IMAPS DPC will be held from March 6 to 8, 2018, at the WekoPa Resorts and Casino in Fountain Hills, USA.
10553 Berlin, Germany
+49 30-349 85-220
Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries, as well as for the decorative and functional surface finishing industries. Atotech has annual sales of USD1.1 billion. The company is fully committed to sustainability – we develop technologies to minimize waste and to reduce environmental impact. Atotech has its headquarters in Berlin, Germany, and employs more than 4,000 people in over 40 countries.