Automate with KIC i4.0 Profiling and Software at NEPCON South China

KIC is pleased to announce plans to exhibit at NEPCON South China, scheduled to take place Aug. 28-30, 2018 at the Shenzhen Convention & Exhibition Center. The new RPI i4.0 automatic profiling system with network software for real-time dashboard, data sharing and traceability storage will be demonstrated in Booth 1C53.

KIC RPI i4.0 automatically acquires profile data from each product soldered in the reflow or curing oven, in real-time. This new ecosystem offers full thermal process traceability, reduced scrap and rework, improved production line utilization and fast defect troubleshooting. Advanced data search and communication features save engineers valuable time.

The profile is compared to the relevant process window for traceability and can alarm instantly on out of spec conditions. Advanced search and filter functions on product name, customer name, time period and more, instantly provide pertinent data for deeper insight and effective troubleshooting.

With RPI i4.0 all relevant data can connect to the factory MES or your factory data collection system to be easily shared with personnel, and can be accessed from any authorized PC or mobile device. The enhanced level of automation delivers improved line utilization and productivity.

KIC’s team also will demonstrate the new SPS smart profiler that collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.

The SPS thermal profiler features a small compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, private Wi-Fi for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.

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