Balver Zinn Group at Productronica 2017
The Balver Zinn Group announces that they will be attending Productronica scheduled to take place November 14-17 in Munich, Germany. The Balver Zinn Group will highlight the company’s latest solder technology and services in hall 4, booth #261.
As the licensee we present Nihon Superiors newly patented SN100CV® lead-free micro-alloyed solder. The industry standard SN100C® has been proven as the one of the best Silver-free Lead-free solder. Now Nihon Superior has developed remarkable new lead-free solder alloy by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV® alloy offers high reliable solder joints for a lower price compared to Ag-containing alloys.
SN100CV® has all the advantages that have made SN100C® so popular, including reduced copper dissolution rates. The lower surface tension of the solder and less surface oxidation related to the germanium, will provide better wetting and flow properties.
Balver Zinn has over 13 years of experience in manufacturing SN100C® and can rely on an extensive global partner network. In 2013 Balver Zinn has been granted the right to sub-license the SN100C® patent by Nihon Superior Co. Ltd.
During the Productronica show Keith Sweatman from Nihon Superior Co. Ltd. will be present at the Balver Zinn booth to provide support whenever special attention is needed to optimize the SN100C® processes. Keith Sweatman is graduate in metallurgical engineering and since 2001 he has been assisting Nihon Superior Co, Ltd. and development of their global business in lead-free solders.
Also at the Productronica show will be Cobar OT2M and BSA04-XSP solder paste along with B2012 solder wire and the extensive range of Cobar solder fluxes.