The best inspection from all perspectives with Viscom’s new 360View feature
Viscom announced plans to exhibit in Booth #305 at SMTA International, scheduled to take place Sept. 26-27 at the Donald Stephens Convention Center in Rosemont, Illinois. The company will show a revolutionary new level of 3D AOI image quality.
With a complete lineup of 3D inspection systems for the electronics industry, Viscom is offering a unique solution to integrate processes and improve production yields. The portfolio includes solder paste inspection (SPI), automatic optical inspection (AOI), and X-ray systems (AXI/MXI) with micro-computed tomography (µCT) for the highest defect coverage. Inspection of wire bond connections and conformal coating also is included. Experts will be available at the exhibition to provide information on any aspect of the product line.
A highlight at the Viscom booth will be the worldwide live premiere of 360View, showing best-in-class 3D AOI image quality, demonstrated on the S3088 ultra blue. The highly standardized and economic AOI system offers five camera views including 3D inspection. For electronics manufacturers, the S3088 ultra blue is the perfect solution to ensure that IPC standards are met. To meet the needs of all customers, (e.g. nine views and higher throughput) the models S3088 ultra and S3088 ultra gold are available.
The software behind 360View renders all image data with unbeatable accuracy – not only on top of components, but also on all sides. The surface texture is generated with very high detail. It is available for a wide range of Viscom AOI systems including the S3088 ultra gold, S3088 ultra, S3088 ultra blue, S6056 and the S7056 (AOXI model).