Capital Expo & Tech Forum

Tuesday August 30, 2016
Location: Johns Hopkins University/Applied Physics Lab
Kossiakoff Center
11100 Johns Hopkins Road
Laurel, MD 20723


Plan now to join us for free technical sessions, free lunch and the chance to network with leading suppliers to our industry!

Exhibit Hours:
Tuesday, August 30th, 2016

Registration Opens at 8:00AM

Free Technical Program & Schedule:

Registration opens

Exhibit Hall Opens

9:00AM – 9:45AM
FiedlerHow 3D Printing Hardware and New Materials are Changing the Face of Manufacturing
Matthew Fiedler, re:3D, Inc.

The current state of affordable additive manufacturing will speed your time to market, reduce tooling cost, improve you product quality and expand your market verticals. Find out how the advances in additive manufacturing are improving the bottom line for business and changing the way things are made.

11:00AM – 11:45AM
CarboniVideo Analysis of Solder Paste Release From Stencils
Debbie Carboni, KYZEN Corporation

Solder paste release from the stencil is a critical factor in print quality, and ultimately, overall electronic product quality and reliability. To better understand release mechanics, an experiment was devised using a video microscope to capture the separation of the stencil from the PCB. The experiment incorporates different aperture area ratios, solder pastes, stencil nanocoatings and underwipe solvents to visualize their effects on paste release. This study builds on previous research that developed the test setup and recording methods, and incorporates some modifications to the original experimental configuration to improve image quality. The outputs of the experiments are videos that demonstrate the effects of solder paste formulation, solvent under wiping and nanocoating on paste release at different area ratios. The paper will discuss the observations from the videos, and the presentation will play the videos.

12:00PM – 1:00PM
Complimentary Lunch and Drawing for Door Prizes!


1:00PM – 1:45PM
CoyleImplementation of a Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of 3rd Generation Pb-Free Solder Alloys
Richard Coyle, Ph.D., Nokia

Significant innovations in Pb-free solder alloy compositions are being driven by volume manufacturing, field experiences, and evolving application requirements. Pb-free solder alloy development is focused on shortcomings of the first generation commercial, high Ag content, near-eutectic SAC alloys, as well as those of second generation lower Ag alloys. The search continues for alloys that can resist thermal fatigue damage in increasingly aggressive use environments, while providing acceptable performance under drop, shock and vibration loading conditions. In 2009, the International Electronics Manufacturing Initiative (iNEMI) launched the iNEMI Characterization of Pb-free Alloy Alternatives project to address the lack of information on the thermal fatigue performance of second generation Pb-free alloys. A comprehensive program based on thermal cycling and materials characterization of first and second generation commercial Pb-free solders was completed and the results were documented in a series of conference papers between 2012 and 2015. The project team continued to track alloy development as the thermal cycling testing progressed and in late 2014 began plans to extend the program to address the emerging 3rd generation Pb-free alloys. In May 2016 the iNEMI Alloy project and the Harsh Use Environment project sponsored by the High Density Package User Group (HDPUG) agreed to collaborate on a program to assess thermal cycling reliability of 3rd generation alloys.

Third generation Pb-free solder alloys focus on two prominent development paths. In one case, alloys with Ag content lower than SAC305 are being developed to address needs for better drop/shock resistance, lower processing (melting) temperature, and lower cost. These alloys would be relevant for consumer applications and complex telecommunication applications requiring lower temperature assembly. In the other case, the high Ag content alloys are being modified with various major alloying additions to improve thermal fatigue performance under conditions of severe thermal cycling and increase resistance to damage from high strain rate mechanical loading. This paper describes the experimental program and alloy selection for evaluating the thermal cycling performance of 3rd generation alternative Pb-free solder alloys.

2:00PM – 2:45PM
KunkleAn Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios
Bill Kunkle, MET Stencil

Certain types of Nano coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These Nano coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge.

This paper presents data on small area ratio printing for component designs including 01005 (0402 metric) chip components and 0.3 mm and 0.4 mm pitch micro BGAs. The aperture area ratios studied range from 0.80 down to 0.30. The effects of Nano coatings are studied and compared to uncoated laser cut steel stencils. Two types of stencil materials are evaluated including fine grain and ultra fine grain steels. Stencil thicknesses are varied from 0.003 inch (75 µm) to 0.004 inch (100 µm) to 0.005 inch (125 µm). Lastly solder paste powder size is varied including IPC Types 3, 4 and 5. The effects of all of these variables are examined in relation to small aperture area ratios. Based on the results of the work a set of guidelines for stencil material, nano coating and solder paste type will be proposed in order to achieve good solder paste printing results.

Expo Closes

The cost to exhibit is $375/$475 (early/regular) for corporate members. The cost to exhibit for non corporate members is $450/$550 (early/regular).(click here for membership information).

The cost to exhibit includes: one 6ft draped table, two chairs, company sign, lunch, directory listing and attendee list. Electricity is an additional $25 per outlet. Early Bird pricing ends Friday, July 29th, 2016!

Important Exhibitor Materials:




Please contact SMTA Expo Manager Kaitlyn Gherity with questions or for additional information.


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