CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

CyberOptics® Corporation (NASDAQ: CYBE), a global developer and manufacturer of high precision 3D sensing technology solutions, announces plans to exhibit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, CA. The company will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum™ software in Booth #6163.

CyberOptics’ WaferSense® APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. With a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers around the world.

The APS3 solution includes ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data. Easily identify when and where the particles originate and see the effects of cleanings, adjustments and repairs in real-time.
“We’ve taken what is documented as the best known method (BKM) for airborne particle sensing in semiconductor fabs to significantly improve yields and tool uptime, and made it even easier to use,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “Engineers can monitor critical data from one, or multiple devices with an enhanced software application.”

CyberOptics’ Airborne Particle Sensors (APS) have proven to deliver up to 90% time savings, 95% expense reduction and up to 20X the throughput with half the manpower relative to legacy surface scan wafer methods.

Additionally, CyberOptics will display the new PanelSense™ Airborne Particle Sensor (APS-FPD) delivering the same valued benefits as the APS3, but designed specifically for the Flat Panel Display manufacturing market.

About the WaferSense®, ReticleSense® and PanelSense™ Line
The WaferSense and ReticleSense measurement portfolio including the Auto Leveling System (ALS & ALSR), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensors (APS 2, 3, APSR & APSRQ) and the new Auto Multi Sensor (AMS & AMSR), are available in various wafer shaped and reticle shaped form factors depending on the device. The PanelSense measurement portfolio including the Airborne Particle Sensor (APS-FPD) is available in a flat panel display compatible form factor.

For more information about the entire line of CyberOptics solutions please visit


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