CyberOptics Showcases Large Particle Sensing Functionality in Next-Generation Airborne Particle Sensors at SEMICON Japan
Advanced APS2 measurement technology incorporates a wider range of particle sizes in sensors that speed processes and improve yields
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will showcase its next-generation Airborne Particle Sensor technology (APS2) with an extended particle size range at the upcoming SEMICON Japan in Tokyo, December 14-16, 2016 in booth #4605.
CyberOptics’ APS2 portfolio speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. The next-generation APS2 provides even greater versatility, with the industry-leading accuracy and sensitivity valued by semiconductor fabs and equipment OEMs worldwide.
Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) can measure small and large particles. The new large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.
“We’re excited to demonstrate our APS2 devices with large particle capability in Japan, where the world’s largest installed fab capacity is over 4.1 million (200mm equivalent) wafers per month*,” said Mr. Yukinobu Hayashi, Sr. Field Applications Engineer, CyberOptics. “We’ve added this desired functionality to our devices that are recognized as the Best Known Method for wireless airborne particle sensing in semiconductor fabs.”
At SEMICON Japan, CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.