Dr. Mike Bixenman co-authors three papers to be presented during SMTAi
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
The presentation entitled “Cleanliness Process Control – An Innovative Approach to a Complex Problem,” and co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, is scheduled to take place during the Spotlight 4 session on Process Control. Mark McMeen will be presenting.
Surface Insulation Resistance (SIR) testing has commonly been performed by electronics testing labs on industry specific test boards. With the adoption of bottom terminated components, there has been a void for a process control method at the assembly site for measuring electro-chemical reliability. The purpose of this research is to development and validate an SIR process control method that can be implemented at the assembly site.
The presentation entitled, “Dendritic Growth from Chemical Contamination and Partial Cleaning: Fundamental Tests and Application Study,” and co-authored by Bruno Tolla, Ph.D., Denis Jean, Jennifer Allen & Kyle Loomis, KESTER Corporation, and David Lober, KYZEN, will take place during the Flux, Solder, Adhesives Track on Wednesday, Sept. 20 at 11 a.m. Mike Bixenman will be presenting
The purpose of this study is to analyze at a fundamental level the impact of various chemical residues on dendritic growth and corrosion of conductive traces and to correlate these electrochemical effects with real-life application conditions. For this purpose, a non-standard test board enables the quantification of the dendritic growth kinetics between Y-shaped traces, in function of the chemical residue characteristics and environmental conditions.
The presentation entitled, “Localized Ion Chromatography Method Development and Validation,” co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, will take place during the Cleaning Session on Thursday, Sept. 21 at 9:00 a.m.
Component specific test boards developed for both localized IC and SIR testing allow for analyzing problematic ions and electrical resistance responses on specific bottom terminated components. The area where the component is placed is routed out on the test board so the specific component can undergo localized testing. The purpose of this research paper is to develop and validate localized IC testing.
Dr. Mike Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.