Dr. Mike Bixenman receives Best Paper Award for his presentation at ICSR

KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, received the ‘Best of Presentation’ Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his paper entitled “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

“There were many good presentations and to be recognized by my peers is a true honor,” said Mike Bixenman, CTO of KYZEN Corporation, regarding his award. “I am most appreciative of the attendees at the ICSR for selecting my presentation for the ‘Best of Presentation’ award.”

The research paper demonstrates the use of non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.

Dr. Mike Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.

Click Here to request a copy of Dr. Mike’s award winning presentation and technical paper. For more information regarding KYZEN’s award-winning chemistries and technical expertise, visit www.kyzen.com.

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