Dr. Mike Bixenman to present three papers during SMTAI Technical Sessions

KYZEN announced that Mike Bixenman, DBA, will present three papers during the technical sessions at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL.

Dr. Bixenman will present “The Effectiveness of 75% IPA/25% DI Extraction Solution on No-Clean Flux Residues,” co-authored by David Lober, KYZEN and; Marietta Lemieux and Mark McMeen from STI Electronics. The presentation will take place during Session HE4, entitled, “Improving Manufacturing Process to Provide Better Survivability of Electronic Products” on Monday, Oct. 15, 2018 from 3:30- 6 p.m. in Room 46.

The presentation entitled, “Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method” will take place during Session FSA3, “Considerations for Assuring Reliable Assemblies,” on Wednesday, Oct. 17, 2018 from 8 – 10 a.m. in Room 49. The paper was co-authored by Mark McMeen, STI Electronics; Denis Jean, Kester Solder and; Joe Clure, Kurtz Ersa.

Finally, on Wednesday, Oct. 17, 2018, Dr. Bixenman will present “SIR Characterization of No-Clean Flux Residues Under the QFN Component Using Different PCB Board Design Options” during Session MFX4, entitled “Manufacturing Operational Challenges” from 10:30 a.m. – 12 p.m. in Room 46. The paper was co-authored by David Lober, KYZEN and; Mark McMeen and Collin Langley from STI Electronics.

Dr. Mike Bixenman has more than 25 years of experience in the design of electronic assembly cleaning materials and process integration. He has held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.

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