EMPC-2019

European Microelectronics and Packaging Conference
16th – 19th September 2019
Pisa, Italy
www.empc2019.org

The Structures of Microelectronics


EARLY ANNOUNCEMENT – MARK YOUR DIARY

Pisa, the charming city in the famous Tuscany region is a visitors’ paradise with many places of interest to visit. The International Airport “Galileo Galilei” is only 2.7 km away from the Conference Centre. It has become one of the main Italian airports with flights to over 74 destinations all around Europe and globally. It is also a hub for low-cost airlines www.pisa-airport.com

EMPC-2019 in Pisa offers the best of microelectronics & photonics, packaging & interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition. Pisa where tradition, art, culture and business meet harmoniously is ideally located also to extend your visit.

Plan now to prepare your Technical Abstract for EMPC-2019. We will issue a fuller Call for Abstracts in June 2018. Included topics are: Advanced Packaging, Substrate Technologies, Interconnection Technologies, More Than Moore, MEMS & Microsystems, Optoelectronics, Solar Energy & Photovoltaics, Green Electronics, Nano Technologies, Medical Electronics, Power Electronics, Smart Textiles & Wearables, Manufacturing Technologies and Materials, Modelling, Thermal Management, Reliability And Quality, Computing, Applications, Business Aspects.

Short Courses / Tutorials
Proposals are invited from professionals to give 3-hour or 6-hour tutorials on the topics of: High Density Circuits, MEMS & Microsystems, Wire Bonding, Soldering Solutions, and other topics relevant to the Conference.

Call for Exhibitors
The EMPC-2019 exhibition will be held from 17-19 September 2019 and will comprise a shell scheme within the exhibition hall at the Palazzo Dei Congressi. Details of bookings and Exhibition Hall layout are obtainable from info@empc2019.org. The Exhibition Hall is positioned adjacent to the technical session rooms to encourage flow into the exhibition. Coffee and meeting tables are also located in the Exhibition Hall.

empc-2019-_-call-for-abstracts

0

Start typing and press Enter to search