Essemtec to show new all-in-one jetting / placement system at SMTAI
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #207 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.
FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12″. Components with sizes from 01005 up to 1.3 x 3.1″are placed. The machine achieves 10,800 cph (IPC9850) with the release of ePLACE 23 and still remains 50 µm accuracy, 3 sigma with a two nozzle head.
The new version is based on the original award-winning platform, which is the ﬁrst machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.